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ExtrePad Manufacturer 

Taiwan, Singapore, US and European law firms have completed the CMP Pad IP Search and Non-Infringement Analysis on Dingtek ExtrePad EP Product Series. 

Dingtek ExtrePad EP Series products, compared with the features of DOW, RODEL, ROHM&HAAS,  TOYO’s and Cabot’s CMP polishing pad and its related patents that are authorized or may be authorized, were given the opinion of NO IP infringement judgment
 

Polishing Pad Benefits:
Universal pad for Oxide, W , Cu Bulk and Poly, etc.
Balanced performance between Removal Rate and defect
Longer pad life due to low cut rate
Mature product with stable performance

Available Pad Features:
Variable grooving design 
PSA with strong peel strength and excellent  thermal stability 
Sub-pad with outstanding non-absorbency of water
Both Non-window and window product can be provided
Suitable for both 200mm and 300mm wafers

Dingtek State of Art Manufacturing Equipment

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Our Facilities

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Get an estimate for your upcoming project

Dingtek Pte Ltd (Singapore)

Address: 
55 AYER RAJAH CRESCENT, #01-26, SINGAPORE (139949)

Dingtek (Malaysia) Sdn Bhd

Address: 
No. 72, JALAN I-PARK SAC,
TAMAN PERINDUSTRIAN SAC,
81400 SENAI, JOHOR, MALAYSIA

Email: jeffrey.lee@dingtek.com.my

Office: +607-599 6884

© 2025 Dingtek Group

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